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For light-sensitive and high-precision electronic components, our Customized Black Recyclable Antistatic Blister Packing Material offers dual protection against electrostatic discharge and light-induced degradation.
LEENOL
| Quantity: | |
|---|---|
| *Materials | PVC/APET/PETG/PP/PS/PC/ABS/PLA, etc |
| *Thickness | Customized |
| *Size | Customized size |
| *MOQ | 1,000-10,000PCS, depends on dimensions |
| *Usage | For Electronic, Cosmetic, Toys, Hardware & Tools, Stationery Products, Daily Items, etc. |
| *Certification | ROHS, etc |
| *Sample lead time | 3-7 working days mostly |
| *Massive order lead time | 7-15 working days mostly |
| *Payment | L/C，D/P，D/A，T/T， MoneyGram，PAYPAL，Western Union，etc |
| *Package | Carton or pallet |
This specialized packaging features a carbon-infused PS base with surface resistance of 10^4 - 10^6 Ω, classifying it as a conductive material under ESD standards. The opaque black formulation blocks 99.9% of UV and visible light, making it indispensable for semiconductor wafers, photoelectric sensors, and other photosensitive devices. Like all our products, it maintains full recyclability and complies with international environmental regulations.
The integrated carbon fiber network ensures rapid charge dissipation (<0.1 seconds) and prevents charge accumulation even in low-humidity environments (<30% RH). This performance exceeds ESD Association requirements for conductive packaging materials.
Unlike clear alternatives, the black pigmentation eliminates photon-induced electron excitation in sensitive components, reducing failure rates in optoelectronic devices by 65% during storage.
With a Vicat softening point of 100℃ (212°F) and heat distortion temperature of 92℃, this material withstands solder reflow proximity and high-temperature logistics without structural degradation.
Critical use cases include:
Semiconductor Industry: Wafer storage trays and IC chip transport containers
Optoelectronics: LED components, laser diodes, and fiber optic connectors
Military Electronics: Secure packaging for classified communication devices requiring EMI shielding
Does the black color affect antistatic performance?
No—the carbon-based conductive formulation ensures consistent performance regardless of color, with resistance values remaining within ±10% of initial specifications over time.
Can it be used with automated pick-and-place systems?
Yes, our black blisters are compatible with machine vision systems through optional reflective markers and precise dimensional tolerances of ±0.05mm.
What recycling options are available?
The material is fully compatible with PS recycling streams ( resin code #6) and can be processed into non-critical packaging components after decontamination.
| *Materials | PVC/APET/PETG/PP/PS/PC/ABS/PLA, etc |
| *Thickness | Customized |
| *Size | Customized size |
| *MOQ | 1,000-10,000PCS, depends on dimensions |
| *Usage | For Electronic, Cosmetic, Toys, Hardware & Tools, Stationery Products, Daily Items, etc. |
| *Certification | ROHS, etc |
| *Sample lead time | 3-7 working days mostly |
| *Massive order lead time | 7-15 working days mostly |
| *Payment | L/C，D/P，D/A，T/T， MoneyGram，PAYPAL，Western Union，etc |
| *Package | Carton or pallet |
This specialized packaging features a carbon-infused PS base with surface resistance of 10^4 - 10^6 Ω, classifying it as a conductive material under ESD standards. The opaque black formulation blocks 99.9% of UV and visible light, making it indispensable for semiconductor wafers, photoelectric sensors, and other photosensitive devices. Like all our products, it maintains full recyclability and complies with international environmental regulations.
The integrated carbon fiber network ensures rapid charge dissipation (<0.1 seconds) and prevents charge accumulation even in low-humidity environments (<30% RH). This performance exceeds ESD Association requirements for conductive packaging materials.
Unlike clear alternatives, the black pigmentation eliminates photon-induced electron excitation in sensitive components, reducing failure rates in optoelectronic devices by 65% during storage.
With a Vicat softening point of 100℃ (212°F) and heat distortion temperature of 92℃, this material withstands solder reflow proximity and high-temperature logistics without structural degradation.
Critical use cases include:
Semiconductor Industry: Wafer storage trays and IC chip transport containers
Optoelectronics: LED components, laser diodes, and fiber optic connectors
Military Electronics: Secure packaging for classified communication devices requiring EMI shielding
Does the black color affect antistatic performance?
No—the carbon-based conductive formulation ensures consistent performance regardless of color, with resistance values remaining within ±10% of initial specifications over time.
Can it be used with automated pick-and-place systems?
Yes, our black blisters are compatible with machine vision systems through optional reflective markers and precise dimensional tolerances of ±0.05mm.
What recycling options are available?
The material is fully compatible with PS recycling streams ( resin code #6) and can be processed into non-critical packaging components after decontamination.
