English
 |
LN-160A1806LE
LEENOL
| Material: | |
|---|---|
| weight(gsm): | |
| size: | |
| packing /bag: | |
| MOQ: | |
| Quantity: | |
The Leenol LN-160A1806LE Microfiber Cleanroom Wiper is engineered for critical environments requiring exceptional absorbency, ultra-low particle generation, and superior surface cleanliness. Constructed from a high-density 80% polyester and 20% nylon microfiber blend, this wiper ensures efficient removal of fine particles, residues, and contaminants without scratching delicate surfaces. The laser-sealed edges reduce fiber release and provide consistent wiping performance for controlled environments.
Ideal for ISO-Class 3–6 cleanrooms, semiconductor facilities, laboratories, optical manufacturing, and precision assembly lines.
High-density 180gsm microfiber for excellent absorbency and superior cleaning efficiency
Laser-sealed edges to minimize loose fibers and reduce particle shedding
Ultra-low lint performance, suitable for sensitive cleanroom processes
Soft, non-abrasive texture ideal for wiping delicate components
Strong chemical compatibility, suitable for IPA and other cleaning solvents
Classified for ISO-Class 3–6 cleanrooms
Cleanroom double-bag packaging for contamination control
Semiconductor device manufacturing
Precision instrument cleaning
Laboratory surface wipe-down
Optical lens and glass cleaning
LCD/LED/TP panel production
Hard disk drive assembly
High-purity equipment maintenance
Yes. The LN-160A1806LE wiper features laser-sealed edges and ultra-low lint performance, making it suitable for ISO-Class 3–6 cleanrooms used in semiconductor, pharmaceutical, and precision manufacturing applications.
Absolutely. The microfiber blend of 80% polyester and 20% nylon is chemically compatible with IPA and most cleanroom-grade solvents, making it ideal for equipment wipe-down and contamination control tasks.
Laser-sealed edges significantly reduce loose fibers and particle shedding compared to ultrasonic or cold-cut edges. This ensures cleaner wiping performance and helps maintain compliance with strict cleanroom standards.
It is widely used for wiping sensitive surfaces, such as semiconductor wafers, optical lenses, glass substrates, laboratory instruments, printing heads, and high-precision assembly components.
The Leenol LN-160A1806LE Microfiber Cleanroom Wiper is engineered for critical environments requiring exceptional absorbency, ultra-low particle generation, and superior surface cleanliness. Constructed from a high-density 80% polyester and 20% nylon microfiber blend, this wiper ensures efficient removal of fine particles, residues, and contaminants without scratching delicate surfaces. The laser-sealed edges reduce fiber release and provide consistent wiping performance for controlled environments.
Ideal for ISO-Class 3–6 cleanrooms, semiconductor facilities, laboratories, optical manufacturing, and precision assembly lines.
High-density 180gsm microfiber for excellent absorbency and superior cleaning efficiency
Laser-sealed edges to minimize loose fibers and reduce particle shedding
Ultra-low lint performance, suitable for sensitive cleanroom processes
Soft, non-abrasive texture ideal for wiping delicate components
Strong chemical compatibility, suitable for IPA and other cleaning solvents
Classified for ISO-Class 3–6 cleanrooms
Cleanroom double-bag packaging for contamination control
Semiconductor device manufacturing
Precision instrument cleaning
Laboratory surface wipe-down
Optical lens and glass cleaning
LCD/LED/TP panel production
Hard disk drive assembly
High-purity equipment maintenance
Yes. The LN-160A1806LE wiper features laser-sealed edges and ultra-low lint performance, making it suitable for ISO-Class 3–6 cleanrooms used in semiconductor, pharmaceutical, and precision manufacturing applications.
Absolutely. The microfiber blend of 80% polyester and 20% nylon is chemically compatible with IPA and most cleanroom-grade solvents, making it ideal for equipment wipe-down and contamination control tasks.
Laser-sealed edges significantly reduce loose fibers and particle shedding compared to ultrasonic or cold-cut edges. This ensures cleaner wiping performance and helps maintain compliance with strict cleanroom standards.
It is widely used for wiping sensitive surfaces, such as semiconductor wafers, optical lenses, glass substrates, laboratory instruments, printing heads, and high-precision assembly components.
